BGA-PCB-Druckschaltplattenmontage Dienstleistungen Prozesshersteller in China

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BGA-PCB-Druckschaltplattenmontage Dienstleistungen Prozesshersteller in China

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May 17, 2024

Category Connection: PWB-Versammlung

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Stichworte:

#Pcbway Prototyp #PWB-Versammlung der geringen Lautstärke #PWB-Versammlungs-Service

Brief: Discover the advanced BGA PCB Printed Circuit Board Assembly Services Process in China. Our high-density, high-performance BGA PCBs feature immersion gold finish, precise testing, and superior thermal conductivity for optimal electronic performance.

Related Product Features:

Material: Fr4 1.6mm with 6 layers for durability and reliability.
Surface finish: Immersion gold for enhanced conductivity and corrosion resistance.
Kupfergewicht: 70 UM, was eine hohe elektrische Leistung gewährleistet.
Assembly components: IC chips with 484 footprint for high-density integration.
Testing: X-Ray inspection for quality assurance.
Min line width and space: 3mil for precision and compact design.
Solder mask and silkscreen included for protection and labeling.
Die BGA-Gehäusetechnologie bietet überlegene thermische und elektrische Eigenschaften.

Fragen und Antworten:

What is BGA packaging technology?

BGA (Ball Grid Array) is a high-density surface mount packaging technology with spherical pins arranged in a lattice pattern, offering better thermal and electrical performance compared to traditional packages.
Was sind die Vorteile von BGA-PCBs?

BGA-Leiterplatten bieten hohe Dichte, überlegene Wärmeableitung und niederinduktive Leitungen und sind somit ideal für Hochgeschwindigkeits-Elektronikschaltungen und kompakte Designs.
How is the BGA PCB assembly process conducted?

The process includes component procurement, PCB fabrication, precise component placement using pick-and-place machines, soldering (reflow or wave), inspection, testing, and final assembly to ensure quality and functionality.